| PART |
Description |
Maker |
| AN899 |
MCUS - SOLDERING RECOMMENDATIONS AND PACKAGING INFORMATION
|
SGS Thomson Microelectronics
|
| AN1235 |
FLIP-CHIP CSP: PACKAGE DESCRIPTION AND RECOMMENDATIONS FOR USE
|
SGS Thomson Microelectronics
|
| TN1171 |
Description of UFDFPN5, UFDFPN8 and WFDFPN8 for STMicroelectronics EEPROMs and recommendations for use
|
STMicroelectronics
|
| SMTC-1110 SMTC-161 SMTC-162 |
Soldering Tips
|
List of Unclassifed Manufacturers
|
| 51Z120-000B |
SOLDERING TAG
|
Rosenberger Hochfrequen...
|
| APHB1608LVBDSYKJ3C |
Compatible with reflow soldering
|
Kingbright Corporation
|
| AN3025 |
Transistor Mounting and Soldering
|
M/A-COM Technology Solutions, Inc.
|
| APHB1608ZGSYKC |
Compatible with reflow soldering
|
Kingbright Corporation
|
| APHB1608LCGKSYKC |
Compatible with reflow soldering
|
Kingbright Corporation
|
| VFHD1111C-3B72B-TR |
Lead?free soldering compatible
|
STANLEY ELECTRIC CO.,LT...
|
| AN10365 |
Surface mount reflow soldering
|
NXP Semiconductors
|
| MFN1106MS-TR |
Lead?free soldering compatible
|
STANLEY ELECTRIC CO.,LT...
|
